|
Détails sur le produit:
|
| Matière première: | Acier à faible teneur en carbone, céramique Kovar, cuivre de tungstène | Matériel de plomb: | Kovar, cuivre Kovar, alliage de cuivre |
|---|---|---|---|
| Conductivité thermique de la plaque de base: | ＞ 150 W / mK | Étanchéité d'air: | ≤1x10-3Pa.cm3 / s (He) |
| Électrodéposition: | Ni / Au | Fiabilité: | Répond aux exigences MIL-883 |
| Mettre en évidence: | Paquet en verre d'ensemble des automobiles SMD,paquet d'ensemble de transistor du joptec SMD,Paquet d'ensemble de JEDE SMD |
||
Product name: TO and SMD type packages for transistor device
Applications: automatic control of machinery and electrical appliances in the fields of home appliances, automobiles, ships, motor cars, power electronics, etc.
Product characteristics: The external dimensions meet the JEDE standard, and the glass or ceramic air-tight connection is used. It is suitable for insertion and surface mounting. Parallel seam welding or energy storage welding can be used for cover (cap) sealing , the surface is nickel-plated and gold-plated, differential plating areas, differential gold and nickel plating thickness, good heat dissipation, good hermeticity and high reliability.
Technical characteristics
Base material: Low carbon steel, Kovar ceramic, tungsten copper, etc.
Lead material: Kovar, Kovar copper, copper alloy, etc.
Thermal conductivity of base plate: ＞150W/m.K
Air tightness: ≤1x10-3Pa.cm3/s (He)
Plating: Ni/Au
Reliability: Meets MIL-883 requirements
Personne à contacter: JACK HAN
Téléphone: 86-18655618388
