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Détails sur le produit:
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Matériel: | Logement de l'anneau kovar ; avance kovar ; Wcu bas ; isolateur en céramique. | Finition: | Entièrement électrodéposition de l'Au. (La finition pourrait adopter entièrement l'électrodéposition |
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Couvercle: | 4J42 (42alloy) | Verres: | BH-A/K |
Avance: | 4J29 (Kovar) | Anneau de soudure: | HlAgCu28 |
Tube: | 4J29 (Kovar) | Cavité: | 4J29 (Kovar) |
Résistance d'isolation: | la résistance de C.C 100V entre la goupille et le paquet simples est ≥1*1010Ω | ||
Mettre en évidence: | Small through hole Hermetic Package,rugged construction hermetically sealed packaging,encapsulated Hermetic electronic packages |
Product name: | Fiber optic electronic component housing | |
Material: | Housing kovar ring; kovar lead; base Wcu ; ceramic insulator. | |
Finish: | Fully plating Au.(Finish could adopt fully plating or selective plating.) | |
Plating: |
The cavity, the lead and the cover plate are plated Ni8-12um, the cavity, the lead and the cover plate are plated with Au0.04-0.1um. |
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product information: | Material | Quantity |
1. Cover plate | 4J42(42alloy) | 1 |
2. Glass insulators | BH-A/K | 2 |
3. Lead1 | 4J29(Kovar) | 2 |
4. Welding ring1 | HLAgCu28 | 1 |
5. Lead2 | 4J29(Kovar) | 1 |
6. Welding ring2 | HLAgCu28 | 1 |
7. Tube | 4J29(Kovar) | 1 |
8. Cavity | 4J29(Kovar) | 1 |
Insulation Resistance | 100V DC resistance between single pin and package is ≥1*1010Ω | |
Hermeticity | Leak rate is ≤1*10-3Pa.cm3/s | |
Product features: | 1.Fiber optic packages have different structures include optical port ; | |
2.The material of housing are different and are adopted by different features of packages. |
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3.The sections of pin are rectangular or cyclinder. | ||
4.The pin cross bottom or sidewall whose rank accord to customers' needs | ||
5.The sealing cap or lid method adopts proper technique according to structure of packages. |
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6.Finish could adopt fully plating or lead selective plating. |
Personne à contacter: JACK HAN
Téléphone: 86-18655618388